RUBBER-BASED CURABLE HOT-MELT ADHESIVE COMPOSITION

WIPO Patent Application WO/2006/090715

A1

A rubber-based curable hot-melt adhesive composition of the one-pack curable type which is free from the environmental problem associated with solvent-based curable adhesives and from drawbacks of moisture-curable polyurethane-based hot-melt adhesives or conventional two-pack curable hot-melt adhesives, i.e., inconvenience of handling and such economical irrationality that adhesive discard is unavoidable before and after processing. The rubber-based curable hot-melt adhesive composition has heat resistance imparted thereto by bringing an object coated with a hot-melt composition containing an epoxy resin into direct or indirect contact with a hardening accelerator (E) to thereby cause a reaction to proceed from the contact surface. The rubber-based curable hot-melt adhesive composition is characterized by being applicable to, e.g., pressure-sensitive adhesive tapes having a heat resistance of 80°C or higher because the composition has tackiness even after curing.

GOTO HIDEO (JP)
SAKAKIBARA RYOHEI (JP)
TOCHIGI EISO (JP)
KAWAGUCHI MASANORI (JP)

PCT/JP2006/303119

August 31, 2006

February 22, 2006

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YASUHARA CHEMICAL CO LTD (JP)
GOTO HIDEO (JP)
SAKAKIBARA RYOHEI (JP)
TOCHIGI EISO (JP)
KAWAGUCHI MASANORI (JP)

C09J163/00; C09J153/02; C09J201/08

JP2003201459A	2003-07-18
JP2003201458A	2003-07-18
JP2002235061A	2002-08-23
JPH11279521A	1999-10-12
JP2000119620A	2000-04-25
JPH06145625A	1994-05-27
JP2002121501A	2002-04-26
JPH02283781A	1990-11-21

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