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Title:
RUBBER COMPOSITION, VULCANIZED PRODUCT, AND VULCANIZED MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/101276
Kind Code:
A1
Abstract:
Provided is a rubber composition from which a vulcanized product and a vulcanized molded body having excellent wear resistance can be obtained. According to the present invention, provided is a rubber composition containing a chloroprene-based rubber, silica, a silane coupling agent, and a hydrate, wherein the rubber composition contains 5-80 parts by mass of the silica and at least 0.5 parts by mass and less than 20 parts by mass of the hydrate with respect to 100 parts by mass of the chloroprene-based rubber, contains 0.5-15 parts by mass of the silane coupling agent with respect to 100 parts by mass of the silica, and satisfies at least one among the conditions i) and ii) below. Condition i): The rubber composition contains 3-methyl-thiazolidine-2-thione, and contains 0.1-3.0 parts by mass of the 3-methyl-thiazolidine-2-thione with respect to 100 parts by mass of the chloroprene-based rubber. Condition ii): The rubber composition contains compound A and compound B, wherein compound A is at least one selected from among a thiourea-based compound, 3-methyl-thiazolidin-2-thione, and di(5-mercapto-1,3,4-thiadiazol-2-yl)disulfide, compound B is at least one selected from among a thiuram-based compound, a sulfenamide-based compound, a thiazole-based compound, a guanidine-based compound, a benzoimidazole-based compound, N-phenyl-N-(trichloromethyl thio)benzenesulfonamide, and a diazabicyclo undecene-based compound, and the rubber composition contains 0.1-3.0 parts by mass of compound A and 0.01-3.0 parts by mass of compound B with respect to 100 parts by mass of the chloroprene-based rubber.

Inventors:
SAKAI YUKI (JP)
IKARI SATORU (JP)
Application Number:
PCT/JP2023/039699
Publication Date:
May 16, 2024
Filing Date:
November 02, 2023
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L11/00; C08K3/22; C08K3/36; C08K5/46; C08K5/54; C08K5/544
Domestic Patent References:
WO2020095961A12020-05-14
Foreign References:
US9431154B12016-08-30
JP2011122112A2011-06-23
JP2012211345A2012-11-01
JP2017019947A2017-01-26
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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