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Patent Searching and Data


Title:
RUBBER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/043699
Kind Code:
A1
Abstract:
[Problem] To provide: a rubber composition from which a crosslinked product having excellent wear resistance and mechanical strength, such as tensile strength, can be obtained, the state of dispersion of a filler in the crosslinked product obtained from the rubber composition being ideal for improving physical properties; said crosslinked product; and a tire that uses, in a portion thereof, said composition or said crosslinked product, and that is capable of achieving an improvement in rolling resistance and steering stability. [Solution] Disclosed is a rubber composition comprising, per 100 parts by mass of a solid rubber (A): from 0.1 to 50 parts by mass of a modified liquid diene rubber (B) having a functional group derived from a silane compound represented by formula (1); and from 20 to 200 parts by mass of a filler (C). The modified liquid diene rubber (B) satisfies the following (i) to (iii): (i) the weight-average molecular weight (Mw) is greater than or equal to 1,000 to less than 15,000; (ii) the vinyl content is less than or equal to 70 mol%; and (iii) the average number of functional groups per molecule of the modified liquid diene rubber (B) is from 1 to 20.

Inventors:
MAEDA HIROMI (JP)
KODA DAISUKE (JP)
KANBARA HIROSHI (JP)
OHTA SATOMI (JP)
Application Number:
PCT/JP2017/031560
Publication Date:
March 08, 2018
Filing Date:
September 01, 2017
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08L21/00; B60C1/00; C08C19/25; C08J3/24; C08K3/04; C08K3/36; C08L15/00
Domestic Patent References:
WO2009148140A12009-12-10
Foreign References:
JP2013249359A2013-12-12
JP2002114874A2002-04-16
JPS61197646A1986-09-01
JP2000344949A2000-12-12
JP2004262170A2004-09-24
JP2008174759A2008-07-31
JPS62112618A1987-05-23
JP2016037588A2016-03-22
JP2009102566A2009-05-14
JP2012201767A2012-10-22
Other References:
See also references of EP 3508526A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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