Title:
RUBBER SOCKET FOR TESTING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/085661
Kind Code:
A1
Abstract:
The present invention provides a rubber socket for testing a semiconductor device, the rubber socket comprising: a main body having a plurality of conductive holes penetratively formed in a height direction and formed of an insulating first material; a plurality of conductive rods arranged in the height direction in which the plurality of conductive holes are filled with conductive powder; and a holding unit embedded in the main body with a second material having at least one of more excellent heat resistance and cold resistance than the first material, and maintaining the shapes of the main body and the conductive rods even when a temperature condition is changed.
Inventors:
MOON SUNG JUE (KR)
Application Number:
PCT/KR2022/016605
Publication Date:
May 19, 2023
Filing Date:
October 27, 2022
Export Citation:
Assignee:
TFE CO LTD (KR)
International Classes:
G01R31/28; G01R1/04
Foreign References:
| KR102103747B1 | 2020-04-23 | |||
| KR102270278B1 | 2021-06-28 | |||
| KR101936781B1 | 2019-04-03 | |||
| KR102090961B1 | 2020-03-19 | |||
| KR101967401B1 | 2019-04-10 |
Attorney, Agent or Firm:
JYK IP LAW FIRM (KR)
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