Title:
SURFACE TREATMENT AGENT FOR Sn ALLOY AND METHOD OF SURFACE TREATMENT
Document Type and Number:
WIPO Patent Application WO/2004/035862
Kind Code:
A1
Abstract:
A surface treatment agent for enhancing the solder wettability and oxidation resistance of Sn alloy; and further a surface treatment agent for enabling obtaining a solder paste of high storage stability and an Sn alloy plating exhibiting suppressed whisker occurrence. This surface treatment agent is one for Sn alloy characterized in that an acidic phosphoric ester having one or two saturated or unsaturated alkyl groups and/or a salt thereof is contained. There is also provided a method of treating the surface of Sn alloy with this surface treatment agent. The Sn alloy is preferably a solder alloy comprising Sn and any one or at least two of Zn, Bi, Cu, Ag and Sb.
Inventors:
OUCHI TAKASHI
KUMAGAI MASASHI
TSUTITANI YOSHIAKI
TANIMOTO KENJI
KUMAGAI MASASHI
TSUTITANI YOSHIAKI
TANIMOTO KENJI
Application Number:
PCT/JP2003/010717
Publication Date:
April 29, 2004
Filing Date:
August 25, 2003
Export Citation:
Assignee:
NIKKO MATERIALS CO LTD (JP)
International Classes:
C23C22/07; C23C26/00; C23C30/00; (IPC1-7): C23C26/00
Foreign References:
| JPH07188942A | 1995-07-25 |
Attorney, Agent or Firm:
Kagami, Norio (13-5 Akasaka 4-chom, Minato-ku Tokyo, JP)
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