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Title:
SEALING COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/130097
Kind Code:
A1
Abstract:
This sealing composition contains: a first epoxy resin having an epoxy group equivalent of 300 g/eq or greater and a glass transition temperature of 40°C or lower when cured using a polyfunctional phenol resin curing agent and a phosphorus curing promoter; a curing agent; and an inorganic filler.

Inventors:
TANAKA MIKA (JP)
ISHIBASHI KENTA (JP)
KODAMA TAKUYA (JP)
HORI KEICHI (JP)
Application Number:
PCT/JP2019/049923
Publication Date:
June 25, 2020
Filing Date:
December 19, 2019
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; C08G59/68; C08K3/013; C08L63/00; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
WO2012091000A12012-07-05
Foreign References:
JP2013071950A2013-04-22
JP2016219619A2016-12-22
JP2007194405A2007-08-02
JP2019001841A2019-01-10
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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