Title:
SEALING MATERIAL COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/093005
Kind Code:
A1
Abstract:
Disclosed is a sealing material composition composed of a novel resin composition which is excellent in gas barrier properties and also particularly excellent in hot melt adhesion. Also disclosed is a sealing material using such a composition, especially a sealing material for double-glazed glasses. The sealing material composition is characterized by containing a isobutylene polymer (A) having an alkenyl group at the end, a thermoplastic resin (B), and a compound (C) having at least two hydrosilyl groups in a molecule.
Inventors:
NAKAJIMA TOHRU (JP)
AOYAMA TAIZO (JP)
AOYAMA TAIZO (JP)
Application Number:
PCT/JP2005/004908
Publication Date:
October 06, 2005
Filing Date:
March 18, 2005
Export Citation:
Assignee:
KANEKA CORP (JP)
NAKAJIMA TOHRU (JP)
AOYAMA TAIZO (JP)
NAKAJIMA TOHRU (JP)
AOYAMA TAIZO (JP)
International Classes:
C03C27/10; C08G81/02; C09J123/22; C09K3/10; C08L23/08; C08L23/10; C08L23/22; C08L53/02; C08L75/04; C08L83/04; (IPC1-7): C09K3/10; C08G81/02
Foreign References:
| JP2003055528A | 2003-02-26 | |||
| JP2003026895A | 2003-01-29 | |||
| JP2003026896A | 2003-01-29 |
Attorney, Agent or Firm:
KANEKA CORPORATION (Osaka-shi, Osaka 88, JP)
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