Title:
SEALING MATERIAL, ELECTRONIC COMPONENT, ELECTRONIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/202741
Kind Code:
A1
Abstract:
Provided is a sealing material 2 having electromagnetic shielding properties and insulation properties. The sealing material 2 includes a plurality of metal particles 4 and a resin composition 6. The resistance per unit length L-s in at least a part of the surface 2s of the sealing material 2 is 0.1-20 kΩ/mm, and the resistance per unit length L-i in the interior 2i of the sealing material 2 is 0.2 GΩ/mm-10 TΩ/mm.
Inventors:
TAKEUCHI KAZUMASA (JP)
INAGAKI TAKASHI (JP)
IZU RINA (JP)
INAGAKI TAKASHI (JP)
IZU RINA (JP)
Application Number:
PCT/JP2018/016360
Publication Date:
October 24, 2019
Filing Date:
April 20, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08K3/22; H01L23/29; C08K3/32; H01L23/00; H01L23/31; H05K3/28; H05K9/00
Foreign References:
| JPH01283900A | 1989-11-15 | |||
| JP2017188647A | 2017-10-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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