SEALING MATERIAL FOR SOLAR CELL

WIPO Patent Application WO/2006/095762

A1

Disclosed is a sealing material for solar cells which is excellent in transparency, flexibility, heat resistance and adhesiveness without using an organic peroxide, and enables to remarkably improve the production efficiency of a solar cell module. The sealing material exhibits properties adequate for thinner solar cell devices even when an organic peroxide is used. Also disclosed is a solar cell module using such a sealing material for solar cells. Specifically disclosed is a sealing material for solar cells wherein an adhesive heat-resistant layer (A) and a buffer layer (B) are arranged in layers. The difference in flexural rigidity between the adhesive heat-resistant layer (A) and the buffer layer (B) is at least 30 MPa or more. The adhesive heat-resistant layer (A) is preferably composed of an olefin polymer (a) having a melting point of not less than 75&ring C (in accordance with JIS K7121) and a storage modulus at 150&ring C of not less than 10³ Pa. The buffer layer (B) is preferably composed of an olefin polymer (d) having a flexural rigidity of not more than 100 MPa.

NISHIJIMA KOICHI (JP)
MIHARU KENJI (JP)

PCT/JP2006/304449

September 14, 2006

March 08, 2006

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MITSUI DU PONT POLYCHEMICAL (JP)
NISHIJIMA KOICHI (JP)
MIHARU KENJI (JP)

H01L31/042; B32B27/32; C09K3/10

JP2002270881A	2002-09-20
JP2003188402A	2003-07-04
JP2002231990A	2002-08-16
JP2001119047A	2001-04-27
JP2004031445A	2004-01-29
JP2000186114A	2000-07-04
JP2001326374A	2001-11-22
JP2003049004A	2003-02-21

None
See also references of EP 1863098A4

Nakajima, Shigemitsu (11-12 Kanda Mitoshiro-cho, Chiyoda-k, Tokyo 53, JP)

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