SEALING METHOD, SEALING LAYER, MIXED LIQUID FOR SEALING LAYER FORMATION, METHOD FOR PRODUCING SEALING LAYER, AND SEMICONDUCTOR DEVICE

Title:

SEALING METHOD, SEALING LAYER, MIXED LIQUID FOR SEALING LAYER FORMATION, METHOD FOR PRODUCING SEALING LAYER, AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/110534

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing: a sealing method which prevents a semiconductor element and a component that constitute a semiconductor device from corrosion caused by harmful substances; a sealing layer which is used for the sealing method; a mixed liquid which is used for the formation of the sealing layer; a method for producing a sealing layer; and a semiconductor device which uses the sealing method. A sealing method of the present invention for sealing a semiconductor element and a component that constitute a semiconductor device is characterized by forming a sealing layer by any one of (1) a method 1 which uses a composition that contains an epoxy resin and an organic metal oxide, (2) a method 2 which uses a composition that contains an epoxy resin and a filler that is coated with an organic metal oxide, and (3) a method 3 wherein the component is sealed by means of an organic metal oxide, and is subsequently coated with an epoxy resin.

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Inventors:

SHIDA KUNIAKI (JP)
II HIROMOTO (JP)
MAKISHIMA YUKIHIRO (JP)

Application Number:

PCT/JP2019/041717

Publication Date:

June 04, 2020

Filing Date:

October 24, 2019

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Assignee:

KONICA MINOLTA INC (JP)

International Classes:

H01L23/29; C08K5/057; C08K9/04; C08L63/00; H01L21/56; H01L23/31

Domestic Patent References:

WO2010147095A1	2010-12-23
WO2009139463A1	2009-11-19

Foreign References:

JP2002033187A	2002-01-31
JP2006219601A	2006-08-24
JPH0741544A	1995-02-10
JP2015221757A	2015-12-10
JP2006070266A	2006-03-16

Attorney, Agent or Firm:

KOYO INTERNATIONAL PATENT FIRM (JP)

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