Title:
SEALING RESIN COMPOSITION AND ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2021/025146
Kind Code:
A1
Abstract:
A sealing resin composition that is to be used for collectively sealing a circuit board (10) and at least a part of a connector part (20). The connector part (20) is provided with a terminal (21) for electrically connecting the circuit board (10) to an external device and a housing (22) that is placed around the perimeter of the terminal (21) and sealed with the sealing resin composition, said sealing resin composition containing a curing accelerator. The housing (22) contains a thermoplastic resin. In a DSC curve of the sealing resin composition obtained by using a differential scanning calorimeter and raising the temperature from 30°C to 200°C at a rate of 10°C/min, the maximum exothermic peak temperature is 100-163°C inclusive and the half value width of the maximum exothermic peak is 5-25°C inclusive.
Inventors:
KITADA TETSUYA (JP)
Application Number:
PCT/JP2020/030344
Publication Date:
February 11, 2021
Filing Date:
August 07, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08G59/40; C08K3/013; C08L63/00; C08L101/00; H01R13/52; H05K5/00
Domestic Patent References:
| WO2017126307A1 | 2017-07-27 | |||
| WO2017056728A1 | 2017-04-06 |
Foreign References:
| JP2019041010A | 2019-03-14 | |||
| JP2019125624A | 2019-07-25 | |||
| JP2013040298A | 2013-02-28 | |||
| JPH10168286A | 1998-06-23 | |||
| JP2019146043A | 2019-08-29 |
Other References:
See also references of EP 3828220A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: