SEALING RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR

WIPO Patent Application WO/2022/054817

A1

Provided is a sealing resin composition having favorable curing properties and filling properties and excellent continuous productivity when performing molding for sealing at a low temperature. The present invention pertains to a sealing resin composition which is rapidly curable at a temperature of at most 150ºC. When the time until the torque value of the sealing resin composition measured using a curelastometer while heating at a predetermined temperature reaches 0.0098 N∙m is defined as T1, and the time until the torque value reaches 70% of the maximum value is defined as T2, expression (1) is satisfied, and the Shore D hardness (HS) of a cured product obtained by heating the sealing resin composition at a predetermined temperature for a time of 2.5×T1 satisfies expression (2). (Expression 1) T2<2.5×T1 (Expression 2) 80