Title:
SEALING RESIN COMPOSITION AND SEAL
Document Type and Number:
WIPO Patent Application WO/2023/157914
Kind Code:
A1
Abstract:
Provided is a sealing resin composition and a seal which can be used, in particular, with a high-temperature and high-pressure gas, especially hydrogen gas. The sealing resin composition is used in a piston ring 1 that is for sealing a gas. When a molded article of the sealing resin composition is exposed to a gas having a pressure of 82 MPa and a temperature of 200°C for 192 hours, the rate of dimensional changes of the molded article, with respect to the pre-exposure values, is ±1.0% or less, and when the tensile strength of the molded article before exposure is taken to be 100%, the retention rate of the tensile strength after the exposure is 80% or more. The tensile strength of the molded article of the sealing resin composition is 100 MPa or more as determined by a measurement method according to ASTM D638.
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Inventors:
YASUDA KEN (JP)
Application Number:
PCT/JP2023/005430
Publication Date:
August 24, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
NTN TOYO BEARING CO LTD (JP)
International Classes:
F16J9/26; C08K3/02; C08K7/06; C08L71/10; C08L79/08; C08L87/00; C09K3/10; F04B39/00; F16J15/18; F16J15/20; F16J15/3284
Foreign References:
| JP2000303058A | 2000-10-31 | |||
| JP2021141045A | 2021-09-16 | |||
| JP2011002023A | 2011-01-06 | |||
| JP2014070737A | 2014-04-21 | |||
| JP2010020964A | 2010-01-28 |
Attorney, Agent or Firm:
WAKI Hikaru et al. (JP)
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