Title:
SEALING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/068805
Kind Code:
A1
Abstract:
[Problem] To provide: a sealing resin composition having good transparency, moisture permeation resistance, and moist heat-resistant adhesion; and a sealing resin composition sheet obtained from the same. [Solution] The present invention comprises: a sealing resin composition which contains a polyisobutylene resin, a modified polyolefin resin, and a tackifier resin; and a sealing resin composition sheet wherein a layer of the resin composition is formed on a support body.
Inventors:
TAKAHASHI CHIHIRO (JP)
TAKAHASHI SYOUSHI (JP)
AKUTA KENJI (JP)
TAKAHASHI SYOUSHI (JP)
AKUTA KENJI (JP)
Application Number:
PCT/JP2014/079588
Publication Date:
May 14, 2015
Filing Date:
November 07, 2014
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08L23/22; C08L23/26; C08L45/00; H01L51/50; H05B33/04
Domestic Patent References:
| WO2011062167A1 | 2011-05-26 |
Foreign References:
| JP2009524705A | 2009-07-02 | |||
| JP2011231309A | 2011-11-17 | |||
| JP2006117758A | 2006-05-11 |
Attorney, Agent or Firm:
ONO Makoto et al. (JP)
Makoto Ono (JP)
Makoto Ono (JP)
Download PDF: