Title:
SEALING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/065973
Kind Code:
A1
Abstract:
Provided is a sealing resin composition which has excellent humidity resistance, adhesiveness, and transparency. This sealing resin composition contains (A) a polyolefin resin, (B) a hydroscopic filler, (C) a metal complex, and (D) an adhesion-imparting agent, wherein: the content of (B), the hydroscopic filler, exceeds 45 mass% with respect to 100 mass% of the nonvolatile component of the sealing resin composition; and (C), the metal complex, has a configuration in which a bidentate ligand and a monodentate ligand bind to a central metal, where the two ligand atoms of the bidentate ligand are both oxygen atoms and the ligand atom of the monodentate ligand is an oxygen atom.
Inventors:
YAMAMOTO YUKI (JP)
HOSOI MAI (JP)
HOSOI MAI (JP)
Application Number:
PCT/JP2020/037060
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L23/00; C08K3/26; C08K5/07; C08L101/12; H01G9/20; H01L23/29; H01L23/31; H01L31/048
Domestic Patent References:
| WO2019167905A1 | 2019-09-06 | |||
| WO2015068805A1 | 2015-05-14 | |||
| WO2017057708A1 | 2017-04-06 |
Foreign References:
| JP2018162418A | 2018-10-18 | |||
| JP2014210910A | 2014-11-13 |
Attorney, Agent or Firm:
TAKASHIMA, Hajime (JP)
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