Title:
SEALING SHEET, METHOD FOR MANUFACTURING SEALED OPTICAL SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/143627
Kind Code:
A1
Abstract:
This sealing sheet 1 is provided with a sealing layer 2 that is used so as to seal an optical semiconductor element 15. The curve indicating the relationship between temperature T and shear storage elastic modulus G' that is obtained by subjecting the sealing layer 2 to a dynamic viscoelasticity measurement performed at a frequency of 1 Hz and a heating rate of 10°C/minute has a minimum value. The temperature T at the minimum value is within the range of from 60°C to 200°C (inclusive). The shear storage elastic modulus G' at the minimum value is within the range of from 5 Pa to 1,000 Pa (inclusive).
Inventors:
MATSUDA HIROKAZU (JP)
MITA RYOTA (JP)
EBE YUKI (JP)
MITA RYOTA (JP)
EBE YUKI (JP)
Application Number:
PCT/JP2016/056403
Publication Date:
September 15, 2016
Filing Date:
March 02, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L33/52; B32B27/00; C08J5/18; H01L23/29; H01L23/31; H01L33/56
Foreign References:
| JP2014124781A | 2014-07-07 | |||
| JP2013067054A | 2013-04-18 | |||
| JP2010265436A | 2010-11-25 | |||
| JP2013187227A | 2013-09-19 | |||
| JP2004327623A | 2004-11-18 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
Hiroyuki Okamoto (JP)
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