SEMI-CONDUCTIVE COMPOUND COMPOSITION AND METHOD FOR PREPARING SAME

Title:

SEMI-CONDUCTIVE COMPOUND COMPOSITION AND METHOD FOR PREPARING SAME

Document Type and Number:

WIPO Patent Application WO/2023/214764

Kind Code:

A1

Abstract:

The present invention relates to a semi-conductive compound composition and a method for preparing same. More particularly, the present invention relates to: a semi-conductive compound composition comprising a base resin in which two ethylene butylacrylate resins having different melting indexes are mixed, and carbon black, wherein the volume of carbon black in the semi-conductive compound composition is 60 vol% or more based on the total volume of the composition; and a method for preparing same.

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Inventors:

LEE IN JUN (KR)
LIM JAE YUN (KR)
PARK JEONG HYUN (KR)

Application Number:

PCT/KR2023/005954

Publication Date:

November 09, 2023

Filing Date:

May 02, 2023

Export Citation:

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Assignee:

HANWHA SOLUTIONS CORP (KR)

International Classes:

C08L23/08; C08J3/22; C08K3/04; C08K5/098; H01B1/24; H01B9/02

Foreign References:

KR20060111019A	2006-10-26
KR20210080939A	2021-07-01
KR20110035536A	2011-04-06
KR20140112063A	2014-09-22
KR20210080935A	2021-07-01

Attorney, Agent or Firm:

PLUS INTERNATIONAL IP LAW FIRM (KR)

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