Title:
SEMI-FLEXIBLE COMPONENT CARRIER WITH STEPPED LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/087898
Kind Code:
A1
Abstract:
A semi-flexible component carrier (100), the semi-flexible component carrier (100) comprises a stack (101) comprising at least one electrically conductive layer structure (104) and at least one electrically insulating layer structure (105), wherein the layer structures are stacked on top of each other in a stacking direction s; a recess (111) extending from a first main surface (102) of the stack into the stack (101) and extending only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure (106) having a stepped portion (107) is formed, wherein the stepped portion (107) provides a flexible region (113) of the stack with respect to a rigid region (114), (115) of the stack.
Inventors:
XIN NICK (CN)
TUOMINEN MIKAEL (FI)
TUOMINEN MIKAEL (FI)
Application Number:
PCT/CN2019/085337
Publication Date:
May 07, 2020
Filing Date:
April 30, 2019
Export Citation:
Assignee:
AT & S CHINA CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
| CN105657959A | 2016-06-08 | |||
| US20100025086A1 | 2010-02-04 | |||
| CN101547551A | 2009-09-30 | |||
| CN104486903A | 2015-04-01 | |||
| CN109076695A | 2018-12-21 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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