Title:
SEMICONDUCTIVE RESIN COMPOSITION AND FORMED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2002/051940
Kind Code:
A1
Abstract:
A semiconductive resin composition which comprises 100 parts by weight of a liquid crystal polymer (A), 1 to 50 parts by weight of graphite (B) having a fixed carbon content of 95 wt % or more, 1 to 50 parts by weight of a fibrous conductive filler (C) and 1 to 50 parts by weight of a fibrous non-conductive filler (D), with the proviso that the sum of the amounts of (B), (C) and (D) is 25 to 100 parts by weight relative to 100 parts by weight of (A), and that (B):(C) = 1:3 to 4:1 and [(B)+(C)]:(D) = 1:2 to 2:1, and has a volume resistivity of 1 X 10?4¿ to 1 X 10?11¿ Ω cm. The semiconductive resin composition exhibits stable antistatic property without significant reduction in mechanical properties, and thus can be suitably used particularly for electronic parts.
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Inventors:
MIYASHITA TAKAYUKI
OHTAKE MINEO
OHTAKE MINEO
Application Number:
PCT/JP2001/011143
Publication Date:
July 04, 2002
Filing Date:
December 19, 2001
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08J5/00; C08K3/04; C08K7/02; C08K7/04; C08L101/00; H01B1/00; H01B1/24; H05F1/00; (IPC1-7): C08L101/00; C08K3/04; C08K7/02
Foreign References:
| JP2000017179A | 2000-01-18 | |||
| JPH0234665A | 1990-02-05 | |||
| JP2001192518A | 2001-07-17 |
Attorney, Agent or Firm:
Furuya, Kaoru (6th Floor 2-17-8 Nihonbashi-Hamacho Chuo-ku, Tokyo, JP)
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