Title:
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/196232
Kind Code:
A1
Abstract:
This semiconductor apparatus comprises a semiconductor element and an electrically conductive bonding material bonding the semiconductor element to a support member. The semiconductor element has first to fourth element side surfaces. The electrically conductive bonding material has first to fourth edges. The distance between the first element side surface and the first edge in a first direction is greater toward the ends of the first element side surface than at the center of the first element side surface in a second direction orthogonal to the first direction. The distance between the second element side surface and the second edge in the first direction is greater toward the ends of the second element side surface than at the center of the second element side surface in the second direction. The distance between the third element side surface and the third edge in the second direction is greater toward the ends of the third element side surface than at the center of the third element side surface in the first direction. The distance between the fourth element side surface and the fourth edge in the second direction is greater toward the ends of the fourth element side surface than at the center of the fourth element side surface in the first direction.
Inventors:
KONO HIROMASA (JP)
Application Number:
PCT/JP2022/006325
Publication Date:
September 22, 2022
Filing Date:
February 17, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/52
Foreign References:
| JP2012033756A | 2012-02-16 | |||
| JP2019068110A | 2019-04-25 | |||
| JP2019029662A | 2019-02-21 | |||
| JP2015188026A | 2015-10-29 | |||
| JP2021027116A | 2021-02-22 | |||
| JP2009170702A | 2009-07-30 | |||
| JPH08306715A | 1996-11-22 | |||
| US20180040530A1 | 2018-02-08 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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