Title:
SEMICONDUCTOR CHIP TRANSFERRING APPARATUS AND METHOD OF TRANSFERRING SEMICONDUCTOR CHIP USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/139397
Kind Code:
A1
Abstract:
A semiconductor chip transferring apparatus is disclosed. The semiconductor chip transferring apparatus comprises: a first stage on which a relay substrate on which a plurality of semiconductor chips are arranged is detachably mounted; a second stage which is disposed below the first stage and on which a target substrate is detachably mounted; a driving device for moving the first stage; an irradiation device which is disposed above the first stage and irradiates a laser toward the relay substrate so as to transfer the semiconductor chips on the relay substrate to the target substrate; an air injection device which is disposed between the target substrate and the second stage and injects air toward the bottom of the target substrate; and a processor which controls the driving device such that the relay substrate transfers the semiconductor chips to a preset transfer region on the target substrate, controls the air injection device to inject air to a bottom region of the target substrate corresponding to the transfer region, and controls the irradiation device to transfer the semiconductor chips on the relay substrate to the transfer region.
Inventors:
LEE SANG MUN (KR)
BYUN NA EUN (KR)
AHN BYUNGHA (KR)
BYUN NA EUN (KR)
AHN BYUNGHA (KR)
Application Number:
PCT/KR2021/019478
Publication Date:
June 30, 2022
Filing Date:
December 21, 2021
Export Citation:
Assignee:
SELCOS CO LTD (KR)
International Classes:
H01L21/67; H01L21/52; H01L21/683; H01L25/075
Foreign References:
| KR20200121714A | 2020-10-26 | |||
| US20100021280A1 | 2010-01-28 | |||
| JP3059473B2 | 2000-07-04 | |||
| KR20170138794A | 2017-12-18 | |||
| JP2013154643A | 2013-08-15 |
Attorney, Agent or Firm:
KIM, Tae-hun (KR)
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