Title:
SEMICONDUCTOR DEVICE AND DISTANCE MEASURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074190
Kind Code:
A1
Abstract:
[Problem] To provide a semiconductor device and a distance measuring device in which it is possible to reduce parasitic inductance between a plurality of substrates. [Solution] A semiconductor device according to the present disclosure comprises: a first substrate that includes a semiconductor element, a first electrode provided on the semiconductor element, and a second electrode extending in a first direction in plan view; a second substrate that includes a wiring line extending in a second direction parallel to the first direction in plan view, a transistor electrically connected to the wiring line, and a capacitor electrically connected to the wiring line; a first connection portion that electrically connects the first electrode and the second substrate; and a second connection portion that electrically connects the second electrode and the second substrate.
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Inventors:
OKAMURA TAKANORI (JP)
Application Number:
PCT/JP2022/034904
Publication Date:
May 04, 2023
Filing Date:
September 20, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/07; G01C3/06; G01S7/483; G01S17/10; H01L21/60; H01L25/00; H01L25/065; H01L25/18; H01S5/02325; H01S5/042; H01S5/183
Domestic Patent References:
| WO2021005844A1 | 2021-01-14 | |||
| WO2022097390A1 | 2022-05-12 |
Foreign References:
| JP2020038855A | 2020-03-12 | |||
| JP2020031120A | 2020-02-27 | |||
| JP2021136306A | 2021-09-13 | |||
| JP2020027874A | 2020-02-20 | |||
| JP2018004372A | 2018-01-11 |
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
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