Title:
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/024372
Kind Code:
A1
Abstract:
This semiconductor device comprises a first semiconductor element, a second semiconductor element, a support substrate, and an encapsulating resin, the semiconductor device further comprising a heat radiation member that is located on a rear surface. The heat radiation member includes a plurality of first protruding elements, each having a first base portion, a second base portion, a first raised portion, a second raised portion, and a first tip portion. The plurality of first protruding elements are arranged in a matrix along a plane that includes a first direction and a second direction.
Inventors:
FUJI KAZUNORI (JP)
Application Number:
PCT/JP2023/023825
Publication Date:
February 01, 2024
Filing Date:
June 27, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/36; F28D7/16; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
| WO2008123488A1 | 2008-10-16 |
Foreign References:
| JP2020061395A | 2020-04-16 | |||
| JPH0883871A | 1996-03-26 | |||
| JP2004023003A | 2004-01-22 | |||
| JP2008014566A | 2008-01-24 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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