Title:
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074179
Kind Code:
A1
Abstract:
The present technology regulates the characteristics of each one of a plurality of individualized semiconductor elements. The present technology provides a semiconductor device which is provided with a first semiconductor element and a plurality of second semiconductor elements each having a circuit that processes a signal from the first semiconductor element. With respect to this semiconductor device, the first semiconductor element and the plurality of second semiconductor elements are stacked upon each other; and a first film which is formed on at least one of the plurality of second semiconductor elements has a configuration that is different from the configuration of second films which are formed on the other second semiconductor elements.
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Inventors:
YUGA YUI (JP)
Application Number:
PCT/JP2022/034678
Publication Date:
May 04, 2023
Filing Date:
September 16, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/31; H01L25/065; H01L25/18
Domestic Patent References:
| WO2021049302A1 | 2021-03-18 | |||
| WO2019048984A1 | 2019-03-14 |
Foreign References:
| JP2021106192A | 2021-07-26 | |||
| JP2017147443A | 2017-08-24 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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