Title:
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/036678
Kind Code:
A1
Abstract:
Provided in the embodiments of the present disclosure are a semiconductor device and a forming method therefor. The semiconductor device comprises: a substrate; and a plurality of semiconductor die groups which are located on a surface of the substrate and are successively stacked in a first direction, the plurality of semiconductor die groups being respectively connected to different channel regions, the plurality of semiconductor die groups being all electrically connected to the substrate, and the first direction being the thickness direction of the substrate. Each semiconductor die group comprises a first die and a second die which are bonded face to face, the first die and the second die being connected to the same channel region.
Inventors:
LV KAIMIN (CN)
Application Number:
PCT/CN2022/118620
Publication Date:
February 22, 2024
Filing Date:
September 14, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/52
Foreign References:
| US20220208649A1 | 2022-06-30 | |||
| US20080036082A1 | 2008-02-14 | |||
| CN104916552A | 2015-09-16 | |||
| US20130049191A1 | 2013-02-28 | |||
| US20080088031A1 | 2008-04-17 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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