Title:
SEMICONDUCTOR DEVICE HAVING U-SHAPED STRUCTURE AND FABRICATING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/213115
Kind Code:
A1
Abstract:
Disclosed are a semiconductor device having a U-shaped structure, a fabricating method therefor, and an electronic device comprising same. According to an embodiment, the semiconductor device may comprise: a first fin and a second fin that extend in a vertical direction with respect to a substrate and are opposed to each other; and a connecting nanosheet, for connecting the bottom ends of the first fin and the second fin to form a U-shaped structure, wherein the connecting nanosheet is spaced apart from the top surface of the substrate.
Inventors:
ZHU HUILONG (US)
LI CHEN (CN)
LI CHEN (CN)
Application Number:
PCT/CN2021/082400
Publication Date:
October 28, 2021
Filing Date:
March 23, 2021
Export Citation:
Assignee:
INST OF MICROELECTRONICS CAS (CN)
International Classes:
H01L29/78; H01L21/336; H01L29/06
Foreign References:
| CN111477684A | 2020-07-31 | |||
| CN109103254A | 2018-12-28 | |||
| US20140239394A1 | 2014-08-28 | |||
| US20170069759A1 | 2017-03-09 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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