Title:
SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184002
Kind Code:
A1
Abstract:
The present invention improves heat dissipation efficiency. This semiconductor device of the present technology comprises: a substrate section on which a semiconductor chip is mounted, and for which an external connection terminal for performing electrical connection with the outside is formed on a rear surface on the side opposite to the front surface which is the surface of the side on which the semiconductor chip is mounted; an outer wall section projecting to the front surface side in the outer periphery of the substrate section; a lid section that is supported by the outer wall section and that covers the semiconductor chip; and a heat storage member that is placed at a position that is inside the outer wall section between the rear surface of the substrate section and the rear surface of the lid section.
Inventors:
WATANABE TSUYOSHI (JP)
NAKAYAMA HIROKAZU (JP)
SHIGETA HIROYUKI (JP)
SHIBUE HITOSHI (JP)
KOBAYASHI HIROTAKA (JP)
HAREYAMA KOSUKE (JP)
NAKAYAMA HIROKAZU (JP)
SHIGETA HIROYUKI (JP)
SHIBUE HITOSHI (JP)
KOBAYASHI HIROTAKA (JP)
HAREYAMA KOSUKE (JP)
Application Number:
PCT/JP2020/004376
Publication Date:
September 17, 2020
Filing Date:
February 05, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/13; H01L23/36; H04N5/369
Domestic Patent References:
| WO2015198770A1 | 2015-12-30 |
Foreign References:
| JP2015198319A | 2015-11-09 | |||
| JP2015029036A | 2015-02-12 | |||
| JP2008041756A | 2008-02-21 | |||
| JP2008041759A | 2008-02-21 | |||
| JPH1041595A | 1998-02-13 |
Other References:
See also references of EP 3940766A4
Attorney, Agent or Firm:
IWATA, Masanobu et al. (JP)
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