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Title:
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179494
Kind Code:
A1
Abstract:
A semiconductor device according to an embodiment of the present disclosure comprises a first wire layer having a plurality of first wires extending in one direction, and a first insulating layer disposed on the first wire layer, wherein the first insulating layer forms an air gap in at least partly between the plurality of wires, and has a stacked region over the air gap in which a first insulating film and a second insulating film which are made of different materials are stacked.

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Inventors:
NAGAHAMA YOSHIHIKO (JP)
Application Number:
PCT/JP2020/007048
Publication Date:
September 10, 2020
Filing Date:
February 21, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L21/8234; H01L23/522; H01L23/532; H01L27/00; H01L27/088; H01L27/146; H04N5/335
Foreign References:
JP2006261440A2006-09-28
JP2004193431A2004-07-08
JP2015023150A2015-02-02
JP2012015400A2012-01-19
JP2013232647A2013-11-14
US20070018075A12007-01-25
US20140138752A12014-05-22
JP2014236183A2014-12-15
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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