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Title:
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243669
Kind Code:
A1
Abstract:
A first semiconductor device according to one embodiment of the present disclosure comprises: a first structure layer having a chip-on-wafer structure in which a first circuit chip and a second circuit chip that have different technology nodes have been mounted; and a second structure layer having a chip-on-wafer structure that is layered on the first structure layer.

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Inventors:
YOKOYAMA TAKASHI (JP)
HANEDA MASAKI (JP)
Application Number:
PCT/JP2023/022129
Publication Date:
December 21, 2023
Filing Date:
June 14, 2023
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N25/70; H04N25/704; H04N25/705
Domestic Patent References:
WO2022080125A12022-04-21
Foreign References:
JP2018170471A2018-11-01
JP2020072410A2020-05-07
JP2021190440A2021-12-13
JP2019068049A2019-04-25
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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