Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/196752
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor device manufacturing method including steps 1-3, said method using a double-sided adhesive sheet that has an adhesive layer (X1), a base material layer (Y), and an adhesive layer (X2) in this order; in which at least one of the adhesive layer (X1) and the base material layer (Y) is a thermally expandable layer containing thermally expandable particles; and in which irregularities are formed on the surface of the adhesive layer (X1) as a result of the thermally expandable layer being expanded.
Inventors:
KAKIUCHI YASUHIKO (JP)
KAWADA SATOSHI (JP)
KAWADA SATOSHI (JP)
Application Number:
PCT/JP2022/012171
Publication Date:
September 22, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/02; H01L21/301; H01L21/304; H01L21/52; H01L21/683
Domestic Patent References:
| WO2020196756A1 | 2020-10-01 | |||
| WO2019181447A1 | 2019-09-26 |
Foreign References:
| JP2005116679A | 2005-04-28 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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