Title:
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2015/083042
Kind Code:
A1
Abstract:
An objective of the present invention is to provide a new peeling method and a manufacturing method for a device. When dividing an M-O-W bond (where M is a given element) by applying physical force, fluid enters the gaps to form an M-OH HO-W bond, which can promote separation because of the increase in the bond distance. A roller such as a drum roller can be used for separation. A portion of the surface of the roller may exhibit adhesiveness. For example, an adhesive tape or the like may be adhered to a portion of the surface of the roller. By rotating the roller, a layer to be peeled can be wound and separated from a substrate having an insulation surface.
Inventors:
YAMAZAKI SHUNPEI (JP)
OHNO MASAKATSU
ADACHI HIROKI
IDOJIRI SATORU
TAKESHIMA KOICHI
OHNO MASAKATSU
ADACHI HIROKI
IDOJIRI SATORU
TAKESHIMA KOICHI
Application Number:
PCT/IB2014/066346
Publication Date:
June 11, 2015
Filing Date:
November 26, 2014
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB (JP)
International Classes:
H01L21/02; H01L21/20; H01L21/336; H01L29/786; H01L51/50; H05B33/10
Foreign References:
| JP2005033219A | 2005-02-03 | |||
| JP2009278124A | 2009-11-26 | |||
| JP2007288173A | 2007-11-01 | |||
| JP2012182503A | 2012-09-20 |
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