Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN
Document Type and Number:
WIPO Patent Application WO/2020/080525
Kind Code:
A1
Abstract:
In the present invention, a printed circuit board has in-pad vias. In a first step, a first component group 40 is mounted on a first surface S1 of a printed circuit board 10B. A screen 50B to be used in a second step has openings at positions corresponding to a plurality of pads 14 on a second surface S2, and has a recess 56 at a position overlapping in-pad vias 17. Solder paste 60 is applied from above the screen 50B, and the screen 50B is removed. Then, a second component group 70 is mounted on the second surface S2.
Inventors:
SASAO KAZUKI (JP)
WADA KATSUSHI (JP)
WADA KATSUSHI (JP)
Application Number:
PCT/JP2019/041097
Publication Date:
April 23, 2020
Filing Date:
October 18, 2019
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H05K3/34; B23K1/00; B41M1/12; B41M1/34; H05K1/02; H05K3/40; H05K13/04
Foreign References:
| CN1505456A | 2004-06-16 | |||
| JPH06334323A | 1994-12-02 | |||
| JP2008078271A | 2008-04-03 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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