Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/202556
Kind Code:
A1
Abstract:
This semiconductor device comprises a first molded resin body (510) that has a first insulating filler (511) with a particle diameter smaller than the mesh of a wire net (40) and seals a semiconductor chip (20), a wire material (30) and a wiring (101) on the inner side of the wire net (40), and a second molded resin body (520) that includes a second insulating filler (521) with a particle diameter larger than the mesh of the wire net (40) and seals the semiconductor ship (20), the wire material (30), and the wiring (101) on the outer side of the wire net (40) with the first molded resin body (510) and the wire net (40) being interposed therebetween, such a configuration improving productivity and reducing warping during mounting.
Inventors:
NISHIHARA TATSUTO (JP)
Application Number:
PCT/JP2019/015156
Publication Date:
October 08, 2020
Filing Date:
April 05, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/29; H01L23/31
Foreign References:
| US20180233422A1 | 2018-08-16 | |||
| JP2012174912A | 2012-09-10 | |||
| JPH07321254A | 1995-12-08 | |||
| JP2018019067A | 2018-02-01 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
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