Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/027826
Kind Code:
A1
Abstract:
A control terminal (13) is soldered on a conductive pattern-formed insulating substrate (42) that is firmly fixed to a heat dissipating base (41). A resin case (1) is bonded to a circumferential end of the heat dissipating base (41), and covers the conductive pattern-formed insulating substrate (42) side of the heat dissipating base (41). A control terminal (13) is exposed to the outside of the resin case (1) from an opening (2) of the resin case (1). First and second protruding portions (16, 17) which are provided on the side end surface (14) of the control terminal (13), and a protruding step portion (26) of a resin block (21) inserted into the opening (2) of the resin case (1) are fitted with each other. Consequently, a semiconductor device, wherein the control terminal (13) is not brought down into the resin case (1) or pulled out from the resin case (1) even if external forces, such as a compressive load and a tensile load, are applied to the control terminal (13), can be provided.
Inventors:
KODAIRA YOSHIHIRO (JP)
Application Number:
PCT/JP2012/071440
Publication Date:
February 28, 2013
Filing Date:
August 24, 2012
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
KODAIRA YOSHIHIRO (JP)
KODAIRA YOSHIHIRO (JP)
International Classes:
H01L25/07; H01L23/04; H01L23/48; H01L25/18
Foreign References:
| JP2011066255A | 2011-03-31 | |||
| JP2000183276A | 2000-06-30 | |||
| JPH087956A | 1996-01-12 | |||
| JP2000208686A | 2000-07-28 | |||
| US6597585B2 | 2003-07-22 |
Other References:
See also references of EP 2750187A4
Attorney, Agent or Firm:
SAKAI, AKINORI (JP)
Akinori Sakai (JP)
Akinori Sakai (JP)
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Claims: