SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIPO Patent Application WO/2013/058020

A1

The present invention improves current density and also improves reliability of bonding strength of wire bonding. A semiconductor device (1) is provided with a semiconductor element (1a) and an external circuit (1b), which are mounted on a base (1d). The semiconductor element (1a) has a copper electrode (1a-1), i.e., an electrode coated with copper. The copper electrode (1a-1) of the semiconductor element (1a) and the external circuit (1b) are bonded to each other using a copper wire (1c). The thickness of the copper electrode (1a-1) is 5-30 μm. The copper electrode is coated by means of a plating method, a sputtering method or a deposition method. The diameter of the wire is 100-400 μm.

JP2011040704	BALL MOUNTING APPARATUS, BALL MOUNTING METHOD, BALL-MOUNTED SUBSTRATE, AND ELECTRONIC COMPONENT-MOUNTED SUBSTRATE
JP5120515	Circuit connection material and circuit terminal connection structure and connection method
JPH06196519	BONDING WIRE

MOMOSE FUMIHIKO (JP)
SAITOU TAKASHI (JP)
KIDO KAZUMASA (JP)
NISHIMURA YOSHITAKA (JP)
HORASAWA TAKAYASU (JP)

PCT/JP2012/072031

April 25, 2013

August 30, 2012

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FUJI ELECTRIC CO LTD (JP)
MOMOSE FUMIHIKO (JP)
SAITOU TAKASHI (JP)
KIDO KAZUMASA (JP)
NISHIMURA YOSHITAKA (JP)
HORASAWA TAKAYASU (JP)

H01L21/60

JP2009177104A	2009-08-06
JPH01187832A	1989-07-27
JPS61253824A	1986-11-11
JPS62123731A	1987-06-05

HATTORI, KIYOSHI (JP)
Kiyoshi Hattori (JP)

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