Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286531
Kind Code:
A1
Abstract:
This semiconductor device comprises two conductive members, a semiconductor element joined to either of the two conductive members, and a relay terminal joined to the two conductive members. The relay terminal has a first band-shaped part and a second band-shaped part joined to the two conductive members, and a linking part linking the first band-shaped part and the second band-shaped part. The first band-shaped part has a first side. The linking part has a first intermediate side and a first linking side linking the first side and the first intermediate side. When viewed in the thickness direction, the first linking side is positioned away from a first virtual intersection, which is an intersection between a first virtual line overlapping the first side and a second virtual line overlapping the first intermediate side.
Inventors:
TAHARA YASUHIRO (JP)
TAKAHASHI SOICHIRO (JP)
TAKAHASHI SOICHIRO (JP)
Application Number:
PCT/JP2022/024547
Publication Date:
January 19, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L21/607; H01L25/18
Domestic Patent References:
| WO2018168924A1 | 2018-09-20 | |||
| WO2007125939A1 | 2007-11-08 |
Foreign References:
| JP2021057617A | 2021-04-08 | |||
| JP2008141058A | 2008-06-19 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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