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Title:
SEMICONDUCTOR DEVICE MEMBER, LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE MEMBER, AND LIQUID FOR FORMING SEMICONDUCTOR DEVICE MEMBER USING THE METHOD, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATING APPARATUS AND IMAGE DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2008/023746
Kind Code:
A1
Abstract:
Provided is a semiconductor device member which has excellent heat resistance, light resistance, film forming characteristics and adhesiveness, and seals a semiconductor device without causing cracks, peeling and coloring and holds phosphor even when used for a long period of time. The semiconductor device member has a heating weight reduction of 50wt% or less, which is measured by a prescribed heating weight reduction measuring method, and a peeling rate of 30% or less, which is measured by a prescribed adhesiveness evaluation method.

Inventors:
KATO HANAKO (JP)
MORI YUTAKA (JP)
KOBAYASHI HIROSHI (JP)
TOMURA TSUBASA (JP)
Application Number:
PCT/JP2007/066310
Publication Date:
February 28, 2008
Filing Date:
August 22, 2007
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
KATO HANAKO (JP)
MORI YUTAKA (JP)
KOBAYASHI HIROSHI (JP)
TOMURA TSUBASA (JP)
International Classes:
H01L23/29; C09K11/73; C09K11/80; G01N19/04; G01N25/20; H01L23/31; H01L33/32; H01L33/48; H01L33/50; H01L33/56; H01L33/62
Foreign References:
JP2004359756A2004-12-24
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Other References:
YUKIO NARIKAWA ET AL., OYO BUTSURI, vol. 74, 2005, pages 1423 - 1432
AICHE JOURNAL, vol. 44, no. 5, 1998, pages 1141
HYOMEN KAGAKU, vol. 18, no. 9, pages 21 - 26
NORIHIRO INAGAKI, HYOMEN KAGAKU, vol. 19, no. 2, 1998, pages 44 - 51
"Coupling-Zai Saiteki Riyo Gijutsu", INSTITUTE FOR SCIENCE AND TECHNOLOGY
NORIHIRO INAGAKI, HYOMEN KAGAKU, vol. 18, no. 9, pages 21 - 26
KAZUO KUROSAKI, HYOMEN KAGAKU, vol. 19, no. 2, 1998, pages 44 - 51
See also references of EP 2065931A4
Attorney, Agent or Firm:
SANADA, Tamotsu (10-31 Kichijoji-honcho 1-chome, Musashino-sh, Tokyo 04, JP)
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