SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Title:

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2016/067414

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a semiconductor device having a solder bonding structure wherein both improved conductivity with respect to an external electrode and high reliability of the device are achieved. In the present invention, a semiconductor element upper solder (21) is formed to extend from a solder bonding region (R11h) of a surface electrode (11) to a solder bonding region (R31h) of an external electrode (31). The external electrode (31) has a downwardly extending portion (31a) that protrudes further toward the surface side of the surface electrode (11) than other regions. The semiconductor element upper solder (21) has an end surface shape including: a fillet (F1) that is bent upward in the direction toward a solder center point from the surface of the surface electrode (11); and a fillet (F2) that is bent downward in the direction toward the solder center point from the surface of the external electrode (31).

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WO/2013/162519	SUSPENDED INDUCTOR MICROELECTRONIC STRUCTURES
JPS58158457	【考案の名称】ミニモ-ルド型ダイオ-ド

Inventors:

NAKATA YOSUKE (JP)
ISHIHARA MIKIO (JP)
KAWASE TATSUYA (JP)
IMOTO YUJI (JP)
ASADA SHINSUKE (JP)
FUJINO JUNJI (JP)

Application Number:

PCT/JP2014/078926

Publication Date:

May 06, 2016

Filing Date:

October 30, 2014

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01L23/48; H01L23/50

Foreign References:

JPH02126659A	1990-05-15
JPH05315490A	1993-11-26
JP2004228461A	2004-08-12
JP2012156450A	2012-08-16
JP2007019412A	2007-01-25
JP2006173250A	2006-06-29
JP2010050395A	2010-03-04