Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/230297
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor device including a substrate (20) having a front surface (20a) and a rear surface (20b) and a film (30) attached to the rear surface (20b), the method comprising the steps for: attaching the film (30) to the rear surface (20b); half-cutting the film (30) and the substrate (20) from the rear surface (20b) side to form a rear surface-side groove portion (80); attaching a protective member (90) to the film (30) after forming the rear surface-side groove portion (80); and dicing the substrate (20) from the front surface (20a) side after attaching the protective member (90), to form a front surface-side groove portion (110) connected to the rear surface-side groove portion (80).
Inventors:
YAMADA SHUNTARO (JP)
KANDA AKINORI (JP)
YOSHIOKA TETSUO (JP)
NAGAO TAKASHIGE (JP)
MIYASHITA KOUICHI (JP)
KANDA AKINORI (JP)
YOSHIOKA TETSUO (JP)
NAGAO TAKASHIGE (JP)
MIYASHITA KOUICHI (JP)
Application Number:
PCT/JP2018/020005
Publication Date:
December 20, 2018
Filing Date:
May 24, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/301; B24B27/06; H01L21/52
Foreign References:
| JP2007073844A | 2007-03-22 | |||
| JP2006086509A | 2006-03-30 | |||
| JP2005012203A | 2005-01-13 | |||
| US20070155055A1 | 2007-07-05 | |||
| US20130157414A1 | 2013-06-20 | |||
| JP2001127010A | 2001-05-11 | |||
| JP2001291683A | 2001-10-19 | |||
| JP2016134523A | 2016-07-25 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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