Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/007358
Kind Code:
A1
Abstract:
A semiconductor device and a method for manufacturing same. The semiconductor device (10) comprises: an active area (11), a testing area (12), and an inactive area located outside the active area and the testing area. A standard device (100) is manufactured in the active area, and a testing device (200) used for testing a property parameter of the standard device is manufactured in the testing area. By manufacturing a testing device around a standard device and testing an electrical property of the testing device, a corresponding electrical property of the standard device may be estimated in a wafer level test, so that a qualified standard device can be obtained by screening according to the testing result, without the need of cutting and packaging a standard device with a larger size to perform testing, and thus the problem in the art that standard devices cannot pass a wafer level test is avoided, testing processes are saved, and a production cycle is shortened.
Inventors:
ZHANG NAIQIAN (CN)
LIU JIAN (CN)
LIU FEIHANG (CN)
PEI YI (CN)
LIU JIAN (CN)
LIU FEIHANG (CN)
PEI YI (CN)
Application Number:
PCT/CN2018/094450
Publication Date:
January 10, 2019
Filing Date:
July 04, 2018
Export Citation:
Assignee:
DYNAX SEMICONDUCTOR INC (CN)
International Classes:
H01L21/66; H01L23/544
Foreign References:
| CN101847609A | 2010-09-29 | |||
| CN105206601A | 2015-12-30 | |||
| CN103400824A | 2013-11-20 | |||
| CN102945841A | 2013-02-27 |
Attorney, Agent or Firm:
BEIJING BRIGHT IP AGENCY CO., LTD. (CN)
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