Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/073831
Kind Code:
A1
Abstract:
A semiconductor device (1000) comprises: an insulating substrate (2) having a semiconductor element (4) mounted thereon; a base plate (1) joined to a back surface of the insulating substrate (2); a case (8) fixed to the base plate (1) and surrounding the insulating substrate (4); a first sealing portion (11) filling the inside of the case (8) and sealing the semiconductor element (4) and the insulating substrate (2); and a protrusion (9) protruding from an inner wall of the case (8). The protrusion (9) has a through-hole (90) penetrating in a top-view direction inside the inner wall of the case (8), and fills a region from the inner wall of the case (8) to the through-hole (90) in a top view. The first sealing portion (11) is filled so as to be in contact with at least the bottom surface of the protrusion (9). In this way, stress concentration to the first sealing portion (11) is reduced, making it possible to prevent interfacial delamination between the first sealing portion (11) and the case (8).
Inventors:
KISHIMOTO KOKI (JP)
Application Number:
PCT/JP2021/039646
Publication Date:
May 04, 2023
Filing Date:
October 27, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/28; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| WO2017082122A1 | 2017-05-18 |
Foreign References:
| JPH06163745A | 1994-06-10 | |||
| JPH0464255A | 1992-02-28 | |||
| JPH08316357A | 1996-11-29 | |||
| JP2013055150A | 2013-03-21 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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