Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074173
Kind Code:
A1
Abstract:
[Problem] To provide a technology advantageous for reducing a functionally harmful effect in a semiconductor device caused by cracks occurring in a semiconductor substrate. [Solution] This semiconductor device comprises: a plurality of first pixel separation units that have insulators and extend from the front surface toward the rear surface of a substrate; and a plurality of second pixel separation units that have insulators and extend from the rear surface toward the front surface of the substrate. The second pixel separation units form, in one cross-section of the substrate, a plurality of rear separately-extending parts which are separated from each other and locally extend from the rear surface toward the front surface of the substrate. The distance between at least one of the rear separately-extending parts and the front surface of the substrate is different from the distance between at least one of the other rear separately-extending parts and the front surface of the substrate.
Inventors:
FURUMOTO KAZUYA (JP)
Application Number:
PCT/JP2022/034576
Publication Date:
May 04, 2023
Filing Date:
September 15, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/76; H01L21/822; H01L27/04; H01L27/088
Domestic Patent References:
| WO2019111373A1 | 2019-06-13 |
Foreign References:
| JP2017199875A | 2017-11-02 | |||
| JP2014116472A | 2014-06-26 | |||
| US20060220171A1 | 2006-10-05 | |||
| JPH09102586A | 1997-04-15 | |||
| US20200176492A1 | 2020-06-04 |
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
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