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Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/029286
Kind Code:
A1
Abstract:
In the present invention, a semiconductor device comprises: a semiconductor element that has an element main surface and an element rear surface that are oriented toward opposite sides in the thickness direction, and a first electrode that is located on the element main surface; a buffer portion that is bonded to the first electrode in a conductive manner; and a wire that is bonded to the buffer portion in a conductive manner, and includes a first metal.

Inventors:
YOSHIHARA KATSUHIKO (JP)
UMEGAMI HIROKATSU (JP)
Application Number:
PCT/JP2023/025566
Publication Date:
February 08, 2024
Filing Date:
July 11, 2023
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/60
Domestic Patent References:
WO2014175343A12014-10-30
Foreign References:
JP2010258286A2010-11-11
JP2015037151A2015-02-23
JP2019004137A2019-01-10
JP2009293986A2009-12-17
JP2007149714A2007-06-14
JP2020113721A2020-07-27
JP2010278420A2010-12-09
JP2019159189A2019-09-19
JP2015142059A2015-08-03
JP2014203957A2014-10-27
JP2000012605A2000-01-14
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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