Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048187
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, a conductive member, a conductive joining layer, and a first positioning member. The semiconductor element has a first primary surface electrode. The conductive joining layer conductively joins the first primary surface electrode and the conductive member. The first positioning member is disposed between the first primary surface electrode and the conductive member and is in contact with the first primary surface electrode and the conductive member. In one example, the first positioning member is in contact with the conductive joining layer. In one example, the first positioning member contains a metal as a main component.
Inventors:
YOSHIHARA KATSUHIKO (JP)
Application Number:
PCT/JP2023/028284
Publication Date:
March 07, 2024
Filing Date:
August 02, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/18
Foreign References:
| JP2005236019A | 2005-09-02 | |||
| JP2018019000A | 2018-02-01 | |||
| JP2015076511A | 2015-04-20 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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