Title:
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/137600
Kind Code:
A1
Abstract:
[Problem] To suppress the occurrence of a positional shift of a semiconductor chip during resin sealing; and to form a rewiring layer easily and accurately.
[Solution] A semiconductor device 100 according to the present invention is provided with: a substrate 10 which is formed of a cured thermosetting resin, and which has one or more recesses 11; a circuit element 20 which is arranged within a recess 11 of the substrate 10; and a rewiring layer 40 which is connected to the circuit element 20 on the opening side of the recess 11.
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| JPH0752759 | [Title of Invention] Package |
Inventors:
SATO MICHIHIRO (JP)
TAKANO TADASHI (US)
TAKANO TADASHI (US)
Application Number:
PCT/JP2019/048857
Publication Date:
July 02, 2020
Filing Date:
December 13, 2019
Export Citation:
Assignee:
NAGASE & CO LTD (JP)
International Classes:
H01L23/12; H01L21/56
Domestic Patent References:
| WO2016098455A1 | 2016-06-23 | |||
| WO2011145490A1 | 2011-11-24 |
Foreign References:
| US7863096B2 | 2011-01-04 | |||
| JP2010219489A | 2010-09-30 | |||
| JP2005236257A | 2005-09-02 | |||
| JP2001156278A | 2001-06-08 | |||
| JP2007180164A | 2007-07-12 | |||
| JP2016178163A | 2016-10-06 |
Attorney, Agent or Firm:
HIROSE Takayuki (JP)
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