SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2024/053151

A1

The present invention addresses the problem of providing a semiconductor device which exhibits a highly accurate temperature detection function while suppressing an increase in the thermal resistance. The means for solving this problem is a semiconductor device comprising: a semiconductor chip which has a main surface that is covered with a first electrode, and which comprises a semiconductor element; a main terminal which is bonded to a part of the first electrode by a conductive first bonding material, and is electrically connected to the semiconductor element; a plurality of sense terminals which are insulated from the main terminal and the first electrode, are at a distance from the main terminal in plan view, and have a thickness less than that of the main terminal; a temperature sensor which has a first surface that is connected to the respective semiconductor chip-side surfaces of the plurality of sense terminals by a conductive second bonding material; and a resin which partially covers the surfaces of the main terminal, the plurality of sense terminals, the first electrode and the temperature sensor, covers a part of the first surface of the temperature sensor, and is interposed between the temperature sensor and the first electrode. The temperature sensor and the plurality of sense terminals overlap the semiconductor chip in plan view.

MATSUSHIMA HIROYUKI (JP)
SHIMIZU HARUKA (JP)
TSUJIKAWA YUKI (JP)

PCT/JP2023/015685

March 14, 2024

April 19, 2023

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HITACHI LTD (JP)

H01L23/34; H01L23/58; H01L25/065; H01L25/07; H01L25/18

JP2013062277A	2013-04-04
JP2012028700A	2012-02-09
JP2020088257A	2020-06-04
JP2011216806A	2011-10-27

TSUTSUI & ASSOCIATES (JP)

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