Title:
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/021507
Kind Code:
A1
Abstract:
Provided are a semiconductor device and a semiconductor module which enable size reduction while ensuring insulation. A lead frame 1 with a wire circuit formed therein is provided on an insulating substrate 2. A reverse face electrode of a semiconductor element 3 is joined via a solder 41 to the wire circuit of the lead frame 1. The lead frame 1 and an obverse face electrode of the semiconductor element 3 are electrically connected by a wire 5. The lead frame 1 also has a terminal 1a embedded in a seal resin 10 and a terminal 1b exposed from the seal resin 10, the terminal 1a having a terminal block 6 joined thereto via a solder 42. The lead frame 1, the insulating substrate 2, semiconductor element 3, and terminal block 6 are sealed integrally by the seal resin 10.
Inventors:
ROKUBUICHI HODAKA (JP)
SATO KUNIYUKI (JP)
KITAI KIYOFUMI (JP)
SANDA YASUYUKI (JP)
SATO KUNIYUKI (JP)
KITAI KIYOFUMI (JP)
SANDA YASUYUKI (JP)
Application Number:
PCT/JP2018/001939
Publication Date:
January 31, 2019
Filing Date:
January 23, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/28; H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| WO2016199306A1 | 2016-12-15 | |||
| WO2016125674A1 | 2016-08-11 |
Foreign References:
| JP2015207582A | 2015-11-19 | |||
| JP2006269702A | 2006-10-05 | |||
| US20120306091A1 | 2012-12-06 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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