Title:
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157604
Kind Code:
A1
Abstract:
A semiconductor device according to the present invention is provided with a semiconductor element which has a first electrode, a second electrode and a third electrode, wherein the conduction states of the first electrode and the third electrode are controlled by means of the voltage application state of the second electrode. This semiconductor device is additionally provided with a first lead that is electrically connected to the first electrode, a second lead that is electrically connected to the second electrode, a third lead that is electrically connected to the third electrode, a fourth lead, and a sealing resin that covers at least the semiconductor element. The third lead is exposed from the sealing resin to the opposite side in the thickness direction. The fourth lead is bonded to the semiconductor element, while being exposed from the sealing resin to the opposite side in the thickness direction. The semiconductor element has a switching function part. The impedance of the path from the switching function part to the fourth lead is higher than the impedance of the path from the switching function part to the third lead.
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Inventors:
IMAMURA ASUMA (JP)
Application Number:
PCT/JP2023/002555
Publication Date:
August 24, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48
Foreign References:
| JPH1098150A | 1998-04-14 | |||
| JPH0870059A | 1996-03-12 | |||
| JP2002009219A | 2002-01-11 | |||
| JP2002009222A | 2002-01-11 | |||
| JP2007157862A | 2007-06-21 | |||
| JP2015097237A | 2015-05-21 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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