Title:
SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/114202
Kind Code:
A1
Abstract:
A semiconductor device packaging structure and a preparation method therefor. The semiconductor device packaging structure comprises a three-layer film composed of a first SiO2 film, a Si3N4 film, and a second SiO2 film stacked sequentially, wherein the first SiO2 film is prepared by means of thermal oxidation, the Si3N4 film is prepared by means of low pressure chemical vapor deposition, and the second SiO2 film is prepared by means of low temperature atomic layer deposition.
Inventors:
LIU CHEN (CN)
ZHANG YUMING (CN)
LV HONGLIANG (CN)
ZHANG YUMING (CN)
LV HONGLIANG (CN)
Application Number:
PCT/CN2019/125014
Publication Date:
June 17, 2021
Filing Date:
December 13, 2019
Export Citation:
Assignee:
UNIV XIDIAN (CN)
International Classes:
H01L23/06
Foreign References:
| CN108389893A | 2018-08-10 | |||
| CN1382255A | 2002-11-27 | |||
| CN101325170A | 2008-12-17 | |||
| US4001872A | 1977-01-04 | |||
| CN103889458A | 2014-06-25 | |||
| CN109626319A | 2019-04-16 |
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD (CN)
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