Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/070358
Kind Code:
A1
Abstract:
A semiconductor device (10) comprises: a circuit board (2); a semiconductor element (3); a bonding wire (1); a sealing material (4); and a thermosetting resin (5). The semiconductor element (3) is disposed on the circuit board (4). The bonding wire (1) includes a first connection section (11), a second connection section (12), and a first loop section (101). The first connection section (11) is connected to the semiconductor element (3). The second connection section (12) is connected to either the semiconductor element (3) or the circuit board (4). The first loop section (101) is located between the first connection section (11) and the second connection section (12) and comprises a first bent section (13). The sealing material (4) covers the first bent section (14). The thermosetting resin (5) seals the circuit board (2), the semiconductor element (3), the bonding wire (1) and the sealing member (4). The sealing member has an elastic modulus lower than that of the thermosetting resin (5).
Inventors:
ITO YUSAKU (JP)
Application Number:
PCT/JP2019/040224
Publication Date:
April 15, 2021
Filing Date:
October 11, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Domestic Patent References:
| WO2018211751A1 | 2018-11-22 |
Foreign References:
| JP2017224778A | 2017-12-21 | |||
| JP2013058606A | 2013-03-28 | |||
| JPH06333970A | 1994-12-02 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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